ON Semiconductor collaborates with Teledyne Imaging Sensors

ON Semiconductor has collaborated with Teledyne Imaging Sensors to manufacture H4RG-15 image sensor, an Extremely Large Stitched Read Out Integrated Circuit, or ELS ROIC, for astronomy.

The H4RG-15 image sensor, designed by Teledyne, is the latest generation of a 20-year effort sponsored by the National Science Foundation, the National Aeronautics and Space Administration, and Teledyne internal funding to develop increasingly larger and powerful infrared sensors for astronomical research.

The 16 megapixel H4RG-15, which consists of Teledyne's HgCdTe detector material hybridized to a CMOS readout circuit. An enabling technology in the development of the H4RG-15 is the ability to fabricate and reliably yield the 63 mm x 63 mm stitched CMOS ROIC using ON Semiconductor's proprietary 180 nanometer process technology. The ROIC is so large that only four die fit onto a 200 mm wafer.

The H4RG-15 readouts were manufactured at ON Semiconductor's wafer manufacturing facility located in Gresham, Oregon. The H4RG-15 is the next step in the HxRG family of image sensors that Teledyne has developed and delivered to the astronomical observatories, on ground and in space, including the Hubble Space Telescope, the James Webb Space Telescope, and every major ground-based observatory.

"The H4RG-15 is critical to the next generation of ground-based telescopes. The 30-meter class Extremely Large Telescopes (ELTs) and future space missions will be designed around the H4RG-15," stated Richard Blank, Teledyne's senior program manager for the H4RG-15.

"We greatly value our partnership with ON Semiconductor, which has been critical to the successful development of the H4RG-15," added James Beletic, vice president of Space & Astronomy at Teledyne Imaging Sensors.